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NCP5005
PACKAGE DIMENSIONS
TSOP?5
SN SUFFIX
CASE 483?02
D
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
S
5
1
2
4
3
B
OF BASE MATERIAL.
4. A AND B DIMENSIONS DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
L
A
G
C
J
DIM
A
B
C
D
G
MILLIMETERS INCHES
MIN MAX MIN MAX
2.90 3.10 0.1142 0.1220
1.30 1.70 0.0512 0.0669
0.90 1.10 0.0354 0.0433
0.25 0.50 0.0098 0.0197
0.85 1.05 0.0335 0.0413
0.05 (0.002)
H
K
M
H
J
K
L
M
0.013 0.100 0.0005 0.0040
0.10 0.26 0.0040 0.0102
0.20 0.60 0.0079 0.0236
1.25 1.55 0.0493 0.0610
0 _
10 _
0 _
10 _
SOLDERING FOOTPRINT*
1.9
S
2.50 3.00 0.0985 0.1181
0.95
0.074
0.037
2.4
0.094
1.0
0.039
0.7
0.028
SCALE 10:1
mm
inches
*For additional information on our Pb?Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer ’s technical experts. SCILLC does not convey any license under
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NCP5005/D
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